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0.09 0.71

The continuum theory of severity was con rmed in a number of community studies which showed the presence of subclinical forms in normal student populations (Button & Whitehouse, 1981; Clarke & Palmer, 1983, Szmukler, 1983; Mann et al, 1983; JohnsonSabine et al, 1988; Katzman et al, 1984) In fact the subclinical forms were generally estimated to be ve times more common than the full-blown syndromes (Dancyger & Gar nkel, 1995) The epidemiological impression that bulimia and bulimic behaviours appear to be far more prevalent in the community than the anorexic syndrome raised the possibility that the nature of both conditions, despite psychopathological similarities, are different In the case of anorexia, the cardinal feature is restraint, which requires a strong internal drive; however, the bulimic disorder may be more responsive to external environmental reinforces (Palmer, 1999).

It was even suggested that bulimia could be the result from a set of socially contagious behaviours (Chiodo & Latimer, 1983) Hoek et al (1995) in their cross-cultural work in Cura ao have suggested that anorexia c may be more epidemiologically stable while bulimia may increase with growing urbanization (For more discussion on epidemiological issues please refer to the chapter by Hoeken, Seidell and Hoek in this volume) Whether one looked at anorexia or bulimia over time, one thing was consistent: more women than men were demonstrating clinical and subclinical concerns with weight and diet Why should this be an issue speci c to women and why at this point in history.

common methods, this type of exchange provides capabilities for resource discovery, assembly, use, reconfiguration, and discard. Unlike existing exchanges, this type of exchange will provide methods for discovering a complete range of services that can be utilized and manipulated as Grid resources, including options for integration with other distributed Grid resources. This capability provides far more options for fulfilling requirements of services and applications than are possible with traditional exchanges. This type of exchange fulfills the design principles described earlier, especially those related to decentralization. Using such an exchange, there is no need to rely on a carrier cloud for transport. Grid collaborations will be able to manage dedicated communications resources and services within an environment that they can customize directly in accordance with their requirements.

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OAS > or = 0 regardless of par bond curve shapes. OAS = FS when volatility value is zero. OAS = FS = NS when T = 0 (settlement is immediate), or when there is no optionality and the par bond curves are flat.

It has been known for some time that transistors can be scaled down in size in such a way that the device propagation delay decreases in direct proportion to the device dimensions However, if the interconnections are scaled down, it results in RC delays that begin to dominate the IC chip performance at submicrometer dimensions In other words, for the high-density, high-speed submicrometer geometry chips, it is mostly the interconnection rather than the device performance that determines the chip performance So far, the interconnection delays have been reduced by using higher conductivity materials such as replacing aluminum with copper to lower the interconnection resistance, replacing silicon dioxide with a lowdielectric-constant material to lower the interconnection capacitance, and keeping the interconnection thickness almost constant irrespective of the scaling of devices.

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4.2 GLOBAL GRID FORUM (GGF)

For example, in scaling from the 10- to the 1-mm design rules, the interconnection thicknesses were reduced by a factor of 2 or less Now, because of the limitations of the optical lithography systems, it is essential that other approaches be developed to lower the interconnection delays One way of solving this problem is to replace the passive interconnections on a chip by the active interconnections, that is, by inserting inverters or repeaters at appropriate spacings depending on the preferred driving mechanism However, this technique does require more area on the chip and results in higher power consumption In the literature [69, 70], several methods have been discussed for the reduction of transit delays in an interconnection These include driving the interconnection using minimum-size inverters, optimum-size inverters, and cascaded inverters An analysis of these driving methods for the silicon-based ICs is presented in [69].